Precison Micron Diamond Powder Polycrystalline Diamond Powder 3.5um
Polycrystalline Diamond Powder (PDP)
Treeing provides a comprehensive array of synthetic diamond powder in the micron and sub-micron size range.
Industrial diamond powder has the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powder has high thermal conductivity and good electrical insulation, which can be used as a heat sink for semiconductor devices. Besides, diamond powder abrasive has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Micron diamond powders are widely used for the superfinishing of hard materials with demanding specifications for surface quality and dimensional accuracy. For effective use this powder should be mixed into a polishing compound or slurry with some type of a carrier.
Polycrystalline Diamond Powder (PDP)
Polycrystalline diamond powder is formed by explosion method, leading to an aggregate structure without cleavage planes. The resulting high toughness of polycrystalline diamond tolerates three times higher operating pressures than monocrystalline diamond. Its micro-structured, rough particle surface provides numerous contact points between diamond particles and the workpiece. These characters allow for significantly higher material removal rates compared to other diamond types. Typical applications of polycrystalline diamond powder are high-performance lapping and polishing process.
Work Materials
Applications
Treeing provides a comprehensive array of synthetic diamond powder in the micron and sub-micron size range.
Industrial diamond powder has the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powder has high thermal conductivity and good electrical insulation, which can be used as a heat sink for semiconductor devices. Besides, diamond powder abrasive has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Micron diamond powders are widely used for the superfinishing of hard materials with demanding specifications for surface quality and dimensional accuracy. For effective use this powder should be mixed into a polishing compound or slurry with some type of a carrier.
Polycrystalline Diamond Powder (PDP)
Polycrystalline diamond powder is formed by explosion method, leading to an aggregate structure without cleavage planes. The resulting high toughness of polycrystalline diamond tolerates three times higher operating pressures than monocrystalline diamond. Its micro-structured, rough particle surface provides numerous contact points between diamond particles and the workpiece. These characters allow for significantly higher material removal rates compared to other diamond types. Typical applications of polycrystalline diamond powder are high-performance lapping and polishing process.
| Physical Property | State | Detection Method |
| Appearance | Grey Powder | |
| Shape | Razor-edged corners | SEM |
| Crystal Form | Polycrystalline | X-rays Diffraction |
| Particle Size | 0.1-10um (Raw Powders) | Ldsa |
| Dispersion Range | 0-0.15, 0-0.2, 0-0.35, 0-0.5, 0.25-0.35, 0-1, 0-2, 2-4, 3-6, 3-7, 4-8, 4-9, 6-10, 6-12 | Ldsa |
| Chemical Composition | C:>99% | Elemental Analysis |
| Custom-made sizes are also available upon customers' demands. | ||
Work Materials
- Ceramica
- ZnSe Wafer
- Sapphire
- SiC Wafer
- Metallography
- Watch Dial
- Metal Mold
- Gem Stone
- Titanium Alloy Joint
- Stone & Glass
- CBN superhard tools
Applications
- Cutting
- Grinding
- Lapping
- Finishing
- Polishing
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