Industrial Abrasive Synthetic Diamond Micron Powder Micron Size Synthetic Monocrystalline Diamond Powder for Polishing 0-1um
Monocrystalline Diamond Powder (MDP)
Treeing provides a comprehensive array of synthetic diamond powder in the micron and sub-micron size range.
Industrial diamond powder has the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powder has high thermal conductivity and good electrical insulation, which can be used as a heat sink for semiconductor devices. Besides, diamond powder abrasive has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Micron diamond powders are widely used for the superfinishing of hard materials with demanding specifications for surface quality and dimensional accuracy. For effective use this powder should be mixed into a polishing compound or slurry with some type of a carrier.
Monocrystalline diamond powder is produced by high-pressure and high-temperature method. The diamond particles feature an oriented crystal structure with parallel-running cleavage planes. For diamond tools, particle fracturing provides a self-sharpening mechanism and thus increases tool life. It is a popular choice for precision grinding, lapping and polishing of various materials.
Work Materials
Applications
Treeing provides a comprehensive array of synthetic diamond powder in the micron and sub-micron size range.
Industrial diamond powder has the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powder has high thermal conductivity and good electrical insulation, which can be used as a heat sink for semiconductor devices. Besides, diamond powder abrasive has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Micron diamond powders are widely used for the superfinishing of hard materials with demanding specifications for surface quality and dimensional accuracy. For effective use this powder should be mixed into a polishing compound or slurry with some type of a carrier.
Monocrystalline diamond powder is produced by high-pressure and high-temperature method. The diamond particles feature an oriented crystal structure with parallel-running cleavage planes. For diamond tools, particle fracturing provides a self-sharpening mechanism and thus increases tool life. It is a popular choice for precision grinding, lapping and polishing of various materials.
| Size | D10≥(µm) | D50(µm) | D95≤(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 |
| 0.5-1 | 0.38 | 0.581~0.690 | 1.32 |
| 0.5-1.5 | 0.41 | 0.691~0.871 | 1.55 |
| 0-2 | 0.55 | 0.872~0.985 | 1.7 |
| 1-2 | 0.6 | 0.986~1.224 | 2.1 |
| 0.5-3 | 0.75 | 1.225~1.487 | 2.65 |
| 1-3 | 0.9 | 1.488~1.712 | 2.95 |
| 1.5-3 | 1.05 | 1.713~2.014 | 3.4 |
| 2-3 | 1.27 | 2.015~2.302 | 3.84 |
| 2-4 | 1.4 | 2.303~2.754 | 4.6 |
| 2-5 | 1.7 | 2.755~3.312 | 5.65 |
| 3-6 | 2.1 | 3.313~3.898 | 6.35 |
| 3-7 | 2.6 | 3.898~4.676 | 7.5 |
| 4-8 | 3.12 | 4.677~5.400 | 8.6 |
| 4-9 | 3.66 | 5.401~6.062 | 9.55 |
| 5-10 | 4.16 | 6.063~6.700 | 10.6 |
| 5-12 | 4.6 | 6.701~7.673 | 12.1 |
| 6-12 | 5.3 | 7.674~8.549 | 13.5 |
| 7-14 | 5.92 | 8.550~9.483 | 14.8 |
| 8-16 | 6.55 | 9.484~10.78 | 16.85 |
| 8-20 | 7.54 | 10.79~12.56 | 19.7 |
| 10-20 | 8.83 | 12.57~14.18 | 21.95 |
| 12-22 | 9.95 | 14.19~16.05 | 24.9 |
| 12-25 | 11.4 | 16.06~17.65 | 27.4 |
| 15-25 | 12.35 | 17.66~19.55 | 30 |
| 20-30 | 13.75 | 19.56~22.50 | 34.3 |
| 22-36 | 16.1 | 22.51~26.12 | 39.4 |
| 30-40 | 18.9 | 26.13~30.10 | 45.5 |
| 30-50 | 21.8 | 30.11~34.58 | 52.4 |
| 36-54 | 25.2 | 34.59~39.00 | 58.5 |
| 40-60 | 28.2 | 39.01~43.20 | 65.2 |
| 50-70 | 31.2 | 43.21~47.50 | 71.5 |
| 54-80 | 34.5 | 47.51~52.50 | 88.2 |
Work Materials
- Ceramica
- ZnSe Wafer
- Sapphire
- SiC Wafer
- Metallography
- Watch Dial
- Metal Mold
- Gem Stone
- Titanium Alloy Joint
- Stone & Glass
- CBN superhard tools
Applications
- Cutting
- Grinding
- Lapping
- Finishing
- Polishing
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